AIM Web site
NC257:USA SMT 2008 award vision winner
underfill 620(CSP¥Î¥R¶ñ½¦):special for SCP usage SMT New winner
http://www.aimsolder.com/press_room_view.cfm?newsid=49
*composition:63/37,62/36/2,96/4,43/43/14---.
*Lead Free:
CASTIN(AIM paten right):96.2%Tin,2.5%Silver,0.8%copper),0.5%antimony.
SAC305:96.5%Tin,3%Silver,0.5%copper.
Excellent printability and tack force
Long tack time and stencil life
Excellent wetting and solderability
Low residues
Easily cleaned residues
Pass Bellcore and IPC reliability testing
Advantages
*Pin Probe testable residue(2 min. to 2 months).low process residue.
*reduce void on Micro BGA.
*high speed without slumping.
*high humidity & slump tolerance
*no clean,aqueous clean are acceptable.
*passing both SIR and Electromigration testing.
*on hard to-solder-materials, including bare copper and Alloy 42.
Features
*mildly activated resin-base formula.
*meet variety alloys(Lead Free included).
excellent wetting.extended idle time,tack time,stencil life.
*air reflow & nitrogen acceptable. AIM web site:www.aimsolder.com
*pass Bellcore,IPC reliability test.
Easily pin probe tested
High heat and humidity resistance
Suitable for high-speed printing
Residues safe to be left uncleaned on RF devices up to 50 gigahertz
Eliminate solder defects such as voiding and solder beading
