Specifications︰ AIM Web site An alcohol based, rosin/resin and halide free, no-clean liquid flux designed specifically to reduce bridging and leave very low post- process residues for wave solder applications. Features Low Post-Process Residues Rosin/Resin and Halide Free High Activity Level Good Wetting Reduces Bridging Can Be Foamed, Sprayed, Misted, Or Dipped Passes IPC and Bellcore Requirements meet all kind of request: no-clean,water soluble,rosin based types.