产品描述

AIM SAC305, N100C, Sn42/Bi58 无铅锡膏,锡丝 及各种特殊规格焊锡

Underfill, Adhesive 黏著胶

270WR VOC free 助焊剂

产品规格︰ AIM网站 NC257:USA SMT 2008 award vision winner underfill 620(CSP用充填胶):special for SCP usage New winner http://www.aimsolder.com/press_room_view.cfm?newsid=49 美国SMT学会得奖 *各种成份之锡膏:63/37,62/36/2,96/4,43/43/14---. *无铅焊锡: CASTIN(AIM拥有之 ):96.2%Tin(锡),2.5%Silver(银), 0.8%copper(铜),0.5%antimony(锑). SAC305:96.5%Tin(锡),3%Silver(银),0.5%copper(铜). Advantages *Pin Probe testable residue(2 min. to 2 months).low process residue. *reduce void on Micro BGA. *high speed without slumping. *high humidity & slump tolerance *no clean,aqueous clean are acceptable. *passing both SIR and Electromigration testing. *on hard to-solder-materials, including bare copper and Alloy 42. Features *mildly activated resin-base formula. *meet variety alloys(Lead Free included). excellent wetting.extended idle time,tack time,stencil life. *air reflow & nitrogen acceptable. *pass Bellcore,IPC reliability test. Easily pin probe tested High heat and humidity resistance Suitable for high-speed printing Residues safe to be left uncleaned on RF devices up to 50 gigahertz Eliminate solder defects such as voiding and solder beading