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AIM SAC305, Sn100C, Sn/Bi, underfill adhesive

Model No.︰-
Brand Name︰AIM(Canada)
Country of Origin︰Canada
Unit Price︰-
Minimum Order︰-
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Product Description

AIM SAC305, SN100C, Sn/Bi, Au/Sn - - - - alloys

Specifications︰AIM Web site NC257:USA SMT 2008 award vision winner underfill 620(CSP¥Î¥R¶ñ½¦):special for SCP usage SMT New winner http://www.aimsolder.com/press_room_view.cfm?newsid=49 *composition:63/37,62/36/2,96/4,43/43/14---. *Lead Free: CASTIN(AIM paten right):96.2%Tin,2.5%Silver,0.8%copper),0.5%antimony. SAC305:96.5%Tin,3%Silver,0.5%copper. Excellent printability and tack force Long tack time and stencil life Excellent wetting and solderability Low residues Easily cleaned residues Pass Bellcore and IPC reliability testing Advantages *Pin Probe testable residue(2 min. to 2 months).low process residue. *reduce void on Micro BGA. *high speed without slumping. *high humidity & slump tolerance *no clean,aqueous clean are acceptable. *passing both SIR and Electromigration testing. *on hard to-solder-materials, including bare copper and Alloy 42. Features *mildly activated resin-base formula. *meet variety alloys(Lead Free included). excellent wetting.extended idle time,tack time,stencil life. *air reflow & nitrogen acceptable. AIM web site:www.aimsolder.com *pass Bellcore,IPC reliability test. Easily pin probe tested High heat and humidity resistance Suitable for high-speed printing Residues safe to be left uncleaned on RF devices up to 50 gigahertz Eliminate solder defects such as voiding and solder beading
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